JPH0622989Y2 - 電子部品用パッケージ - Google Patents

電子部品用パッケージ

Info

Publication number
JPH0622989Y2
JPH0622989Y2 JP6385488U JP6385488U JPH0622989Y2 JP H0622989 Y2 JPH0622989 Y2 JP H0622989Y2 JP 6385488 U JP6385488 U JP 6385488U JP 6385488 U JP6385488 U JP 6385488U JP H0622989 Y2 JPH0622989 Y2 JP H0622989Y2
Authority
JP
Japan
Prior art keywords
circuit
package
cavity
mark
step portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6385488U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167042U (en]
Inventor
博之 酒井
敏一 竹之内
秀一 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP6385488U priority Critical patent/JPH0622989Y2/ja
Publication of JPH01167042U publication Critical patent/JPH01167042U/ja
Application granted granted Critical
Publication of JPH0622989Y2 publication Critical patent/JPH0622989Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Wire Bonding (AREA)
JP6385488U 1988-05-13 1988-05-13 電子部品用パッケージ Expired - Lifetime JPH0622989Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6385488U JPH0622989Y2 (ja) 1988-05-13 1988-05-13 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6385488U JPH0622989Y2 (ja) 1988-05-13 1988-05-13 電子部品用パッケージ

Publications (2)

Publication Number Publication Date
JPH01167042U JPH01167042U (en]) 1989-11-22
JPH0622989Y2 true JPH0622989Y2 (ja) 1994-06-15

Family

ID=31289342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6385488U Expired - Lifetime JPH0622989Y2 (ja) 1988-05-13 1988-05-13 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JPH0622989Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6089481B2 (ja) * 2012-07-30 2017-03-08 セイコーエプソン株式会社 電子部品の製造方法および電子モジュールの製造方法
JP2023037262A (ja) * 2021-09-03 2023-03-15 富士電機株式会社 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPH01167042U (en]) 1989-11-22

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